Pore Blocker 100 Water soluble immersion pore blocker for use on gold, silver or copper substrates, 30 – 60 seconds at 30 - 40°C Watershed 18 Liquid rinse aid to promote faster stain free drying, 45 – 60 seconds at 20 - 50°C Cuprotec Anti-tarnish (organic) for copper / copper alloys film thickness 30 – 500 ? in 3 – 5 minutes at 60 - 65°C. Cuprotec 3 Anti-tarnish (organic), 72 hours protection of electroless copper coated printed circuits, use in sulphuric dip, 2min, 25°C. Cuprotec 5 Creates a protective film (organic + silver) on copper, designed for high thermal loading, 30 seconds at 25°C. Oxyban 60 Acidic anti-tarnish (organic) for electroless copper substrates immersion in a 1% solution (pH<2) for 2 – 5 mins at 21-38°C No Tarn EC Electrolytic chromate (CrVI) process to protect silver from sulphur staining, 1 - 5 minutes at 20 - 30°C. No Tarn SG-2 Immersion process to protect silver from sulphur induced staining, 5 - 10 minutes at 26°C. Neutra Rinse 40 Solution of alkaline salts to neutralise acid films on tin deposits, to improve solderability & ageing, 1-10 secs, 40 - 60°C. Neutra Rinse 98 Neutralises acidic films after tin plating to improve solderability and ageing, 1 – 10 secs immersion at 20 - 60°C No Tarn SN-2 Stabilises the surface of electroplated tin, minimises the risk of reflow discoloration, 5-30 secs immersion at 15-40°C. Ronablue LR lll Trivalent chromium based blue passivation for zinc, pH 1.5 – 1.7, T = 21 - 32°C, immersion time ca. 15 seconds Ronablack LR Dark black chromate (Cr VI) passivation for zinc, pH 1.5 – 1.8, T = 20 - 28°C, immersion time ca. 3 minutes. Ronaseal 1 Dip coating of a clear organic film (1 - 2µm) for blue passivated zinc deposits, pH 8 – 9.5 at 10asd