Cuprall B Sodium or potassium, rack / barrel use 30 g/l copper, T= 65°C, ca. 0.45 micron/minute @ 2asd Copper Glo 23 Sodium or potassium, rack / barrel use 50 – 60 g/l copper, T= 50°C, ca. 0.8 micron/minute @2asd Cupron Strike Cyanide free, copper / zinc alloy strike for rack / barrel use prior to CuPure, pH 8.5, T= 32°C. CuPure Cyanide FREE alkaline copper, 15g/l copper, pH 10, ca. 0.4 micron / min @ 2asd, 65°C Copper Gleam PCM Plus Acid copper with good ductility for rack / barrel use, dye free additive 0.6 micron/min, 3asd 27°C. Copper Gleam PCM Plus HS High speed copper for R-2-R applications, 2 micron/min, 10asd 30°C can be used in jet equipment. Copper Gleam RG-10 HS MSA based, high speed copper for R-2-R applications, 7 microns / minute @ 35asd, 50°C Copper Gleam XL 180 Dye Free, high levelling bright deposits, 60 microns / hour @ 5asd, 27°C, IF & P-O-P use Copper Gleam DL 880 Dye containing, high levelling bright deposits 60 microns / hour @ 5asd, 27°C, IF & P-O-P use Copper Gleam BL150 Strike Acidic strike process for rapid coverage and good throw onto electroless deposits for P-O-P use. . Specialities Intervia Cu series Acidic electrolytes to produce bright, ductile, copper deposits for Advanced Packaging applications such as producing copper posts, copper bumps, micro via hole filling. Cu 8510 or Cu8530 or Cu8540. Copper Gleam PPR-H Horizontal pulse acid copper for use in R-2-R to plate electronic components on continuous strip.