InterVia 8500 Series Electrolytic acid copper Solderon BP / BP SN1000 BP-Electrolytic solder, BP SN 1000 pure tin, lead free Nikal BP Electrolytic nickel, offered in RTU Aurofab BP Non-cyanide electrolytic gold; RTU (ready to use) formulation Auronal BP Electrolytic gold potassium cyanide based gold Ronaclean 35N Pre-clean, activator, post plate clean Cuproetch BP Etch for copper Duraprep BP 54 Surface cleaner for copper AluPrep BP Cleaner Surface cleaner for aluminium, nitric-based Ronamerse SMT Catalyst CF/Catalyst BP Low palladium activator for copper, chloride free XP-4331 Zincate Acid-based zincate for aluminium Duraprep 520 Zincate Alkaline-based zincate for aluminium NiPlate BP5000 / BP10000 Low phosphorous electroless nickel 4-6% P / 8-10% P Everon BP Mid phosphorous electroless nickel 7-9% P Aurolectroless BP Cyanide containing (GPC), immersion gold Pallamerse BP / Palladep BP Autocatalytic palladium process 1-2%P, gold and aluminium wire bondable Shipley BPR-100 Thick build, negative tone, plating resist, single spin 30-150 microns Megaposit SPR 220 Positive tone, single spin 0.5-30 microns InterVia 8010/8020 Redistribution, Spin on low k dielectric Microposit FSC Protective coating for back side of wafers InterVia 3D-N / 3D-P Aqueous negative (3D-N) and positive (3D-P) plating resist Megaposit MF/ Remover 1165 Developer for photo resist / Stripper for photo resist Microposit EBR-10A Eliminates photo resist edge bead from spin coat processing