NIL (NanoImprint Lithography) Polymers

 
NanoImprint lithography (NIL), first introduced by Stephen Y. Chou et al. in 1995, is a low-cost, high throughput alternative lithographic technology that defines patterns by mechanical deformation of a polymer on the sub-100 nanometre scale.

It is characterized by parallel patterning across the whole wafer and is well suited for mass production of nano-structures.
In December 2003, NIL was included in the International Technology Roadmap for Semiconductors (ITRS) as a next-generation lithography alternative to be employed at the 35 nm node.
A number of potential applications have been proposed for NIL including nano-electronics, optics, high density storage, nano-magnetic devices, nano-fluidics, nano-electromechanical elements, bio-devices, and transducers.

Polymers are one of the keys to NanoImprint lithography (NIL).

Micro resist technology (GmbH) have undertaken a lot of research and development within this field and are now able to offer the following polymers for this emerging market.

  Thermoplastic

Key Points:

  • Standard polymer solutions for 100, 200 & 300nm films.
  • Imprint temperature above the Tg.
  • Smallest pattern size ~ 50nm : depending on stamp design.
  • Plasma etch resistance of mr-I 7000/8000 superior than PMMA. Selectivity in CHF3 is > 2.
  • Preferred as etch mask (single polymer layer process).
  • Customized solutions for various thicknesses are available.

  Thermoset

Key points:

  • Main constituents are a thermocurable pre-polymer and a mixture of solvents.
  • Ready-to-use polymer solution designed for nano-imprint lithography.
  • Imprint temperatures <160°C, imprint pressures < 100 bar.
  • Thermal stability up to 200°C.
  • High resistance to chemicals & plasma etch resistance superior to PMMA. Selectivity inCHF3 is > 2.
  • Suitable for permanent applications.
  • Suitable for low cost polymer stamp fabrication.

Datasheets