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Semiconductor Technologies
Interconnect Technologies
Advanced Packaging Technologies
Pure Ancillary Chemicals
Spin-On Photo-Imageable Dielectrics
Photo-Imageable Insulation Resin which may be easily substituted for conventional dielectric materials such as Polyimide & BCB. Use with TMAH (MIF) and MIB developers.
Ideal alternative to BCB’s and Polyimides.
Datasheets
Rohm and Haas
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