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Latest News
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15th June 2009 14:09:00
Click here for the a presentation on the Use of Inkjet Printing Technology for Fabricating Electronic Circuits
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27th May 2009 07:42:00
Click here for the a new paper about the advantages of Pallamet 600 vs pure gold on connectors.
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26th January 2009 09:57:00
Chestech installs the ASIG process at Beckworth Technical Plating.
The first installation of the ASIG (electroless silver/Immersion gold) process for circuit boards has been successfully installed at Beckworth Technical plating, Alton Hants. UK.
The ASIG process is based upon break through technology that sets new standards for PCB surface finishing.
The process relies upon the use of electroless silver (ESM100) which produces an extremely dense silver deposit followed by immersion gold.
The process aids significantly the ability to gold wire bond to circuit boards and achieve extremely high bond strengths, so much so that in customer testing it has been seen that the wire itself breaks before joint failure.
The density of the deposit is very much higher than that of immersion silver, very thin deposits (0.1u - 0.2u) can be applied with no risk of porosity. The use of the ESM 100 together with the Anti-tarnish AT will give a very long solderable shelf life for the silver only process.
With new legislation coming in regarding the use of nickel on circuit boards it is felt that the ASIG process will be an excellent substitute for circuit boards where nickel is deemed a possible hazard.
For more information on this break through technology please contact us now.
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21st November 2008 18:12:00
Rohm & Haas with circuitree invite you to a FREE webinar.
Free Webinar on Pattern Plate Copper Via Fill Process for Packaging and HDI With Through-Hole Plating
This Webinar describes a new pattern-plate, direct current copper electroplating process designed for HDI and
packaging substrate applications. with through-hole plating. Microvia filling performance, through hole throwing power,
surface distribution, trace / pad profile and product reliability will be presented.
You will learn:
- How evolving PCB substrate designs are pushing the limits of metallization processes and in particular, copper electroplating
- The key process variables affecting microvia filling performance and plated through hole-throwing power
- How to tune the via fill operating parameters for specific end user requirements
- The process capability of a new DC via fill process for HDI and package substrate fabrication
When: December 9th at 9 am PT | 12 pm ET
Where: Online
Duration: 60 minutes
Cost: FREE
Register: http://webinars.circuitree.com
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2nd October 2008 10:51:00
Rohm and Haas Electronic Materials PFT Europe has introduced three environmentally friendly Electroless Nickel processes:.
Niposit PM 988
heralds the dawn of a new era in metallization for Plating-on-Plastics
applications. The Niposit PM 988 process is designed to autocatalytically
deposit Nickel-Phosphorus (4 - 7% P) alloys from a nonammoniacal
alkaline solution.
Key characteristics: Free from Ammonia, contains no Lead or
Cadmium, free from Chloride, low operating temperature (30°C).
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Duraposit MF-0820
is a Lead-free, Cadmium-free mildly acidic Electroless Nickel/
Phosphorus process, specifically formulated to produce bright and
corrosion resistant deposits with a Phosphorus content of 7 - 10% P
depending on bath parameters.
Key characteristics: Lead and Cadmium free deposits, bright deposits,
extremely long bath life (10 mto), stable deposition rate (up to 30
micron/hour).
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Duraposit MF-1110
is an autocatalytic Electroless Nickel process, free of Lead and
Cadmium. Depending on plating parameters, the bright to semi-bright
deposits contain between 10.5 - 13.5% Phosphorus and thus have
excellent corrosion resistance.
Key characteristics: No Lead or Cadmium, deposits have low internal
stress compared with traditional high Phosphorus processes (10
micron/hour).
Visit our PFT Home Page or contact us for more details of these products.
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13th August 2008 11:49:00
AGAS Management Team introduced to Semiconductors.
This month Sally Fairman (Agas Development Director) and Graeme Dewerson (Agas Sales Manager and newly appointed Chestech General Manager) visited INEX in Newcastle Upon-Tyne to get an insight into Semiconductor and Photolithography processing.
During the visit Alistair Brown from INEX gave a full tour of the clean-room and a hands-on demonstration of Photolithography processing demonstrating sub micron features.
INEX is a leading contract development, manufacturing and commercialisation centre for specialist electronic devices, microsystems and nanotechnology.
INEX works with customers to identify and deliver cost effective solutions in a commercially focused environment. By combining design, prototyping and manufacturing expertise with the ideas and technologies of our partners, INEX can manage the entire commercialisation lifecycle of a product from initial concept through to market entry.
www.inex.org.uk
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(From the left: Sally Fairman, Graeme Dewerson, Andy Cooper and Jonathan Sellars)
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27th March 2008 13:56:14
Acquisition of Chestech Limited by A-Gas International.
Chestech Ltd is pleased to announce that on 14th March 2008 it has been acquired by A-Gas International Ltd. Chestech is a leading Distributor to the Circuit Board manufacturing industry, the microelectronics sector and the advanced IC packaging technologies.
A-Gas International is the leading independent global supplier of packaged and bulk refrigerants and foam blowing agents primarily to the UK, South African and Australian markets, with additional sales offices in USA, Mexico, Thailand, Singapore and China. A-Gas is also expanding into specialist gases and chemicals markets such as those served by Chestech. A-Gas brings a strong management team and financial strength to our existing resources, and has the support of our suppliers to continue to expand our product range.
We are keen to retain the strong business links built up with our customers and look forward to continuing to provide comprehensive technical support and services in the future.
If you have any questions resulting from the change of ownership, please do not hesitate to contact the undersigned.
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17th March 2008 18:20:00
Chestech.co.uk has been extended again to improve your online experience further...
Custom Google searching is now available in the left hand menu. Use the power of Google's search technology to index all our pages, product selectors and documents in the public domain.
Our latest 2008 process selectors and product range charts are now available for the packaging and finishing business here under Process Selectors.
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25th January 2008 14:31:12
Chestech is pleased to announce the appointment of a new Micro Account Executive - Andrew Cooper.
Andrew has broad range of technical expertise across the Microelectronics Technologies Industry with over eight years of hands on experience as a lithography engineer in IC manufacture. His career has spanned the complete spectrum of advanced photo resist technologies and thick film processes, initially working for Philips Semiconductors on power devices and more recently at ATMEL working with embedded non-volatile memory and RF SoC devices.
The role of Micro Account Executive enables Chestech to enhance the technical expertise currently existing within the team and to dedicate a greater focus on our micro customers.
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16th November 2007 10:05:12
New Product Range: Chestech have finalized an agreement with Polymer Kompositer to solely represent them in the UK with their ESM Electroless silver processes.
These can be used for the following applications
- Final Finish (solderability and gold wire bonding)
- Microwave
- Solar Panel
See our recent brochure for details: ESM Brochure.
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31st August 2007 10:42:14
New Product Release: New and enhanced product lines go live on site.
We've added some new and enhanced product lines to our range, the details are on the site in the usual
places, you can also access the datasheets using the links below...
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Material Safety Data Sheets
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If you would like to get access to our MSDSs (Material Safety Data Sheets) then please email your request using the following links...
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