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Advanced Packaging
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The SVC-28 has now been replaced by SRX400 which offers superior stripping
of the Dynatex Wafergrip Adhesive.
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Highly Recommended.
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Recommended.
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Not Recommended.
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Wax Removers & debonding Agents
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SRX400
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TBA
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TBA
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TBA
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| Thermoplastic Adhesive Removal |
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TBA |
TBA |
TBA |
| Wax Removal |
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TBA |
TBA |
TBA |
| Wafergrip Removal |
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TBA |
TBA |
TBA |
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| Intervia
Photodielectric 8021 |
Photo-Imageable Insulation Resin which may be easily substituted
for conventional dielectric materials such as Polyimide & BCB.
Use MIF based developers. |
| Intervia
Photodielectric 8010 |
Photo-Imageable Insulation Resin which may be easily substituted
for conventional dielectric materials such as Polyimide & BCB.
Use MIB based developers. |
| BPR Photostripper |
Is a formulated hydrophillic photostripper for dissolving
BPR100 coatings. |
| Microposit
Primer |
Used to increase the adhesion of photoresist to semiconductor
substrates. Based on HMDS. |
| FSC Series |
Non-Imagable protective coating formulated for use during
chemical or mechanical processes. Ie protective layer during the Wafergrip/back
lapping process. |
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